Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17869915Application Date: 2022-07-21
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Publication No.: US11749723B2Publication Date: 2023-09-05
- Inventor: Georgios Vellianitis
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L21/82 ; H01L29/221 ; H01L21/8234 ; H01L29/78 ; H01L29/66

Abstract:
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor channel layer, a gate structure, complex regions, a source terminal and a drain terminal. The gate structure is disposed on the semiconductor channel layer. The source terminal and the drain terminal are disposed on the semiconductor channel layer. The complex regions are respectively disposed between the source terminal and the semiconductor channel layer and between the drain terminal and the semiconductor channel layer.
Public/Granted literature
- US20220367645A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-11-17
Information query
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