Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US17959530Application Date: 2022-10-04
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Publication No.: US11749686B2Publication Date: 2023-09-05
- Inventor: Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: ROBINSON INTELLECTUAL PROPERTY LAW OFFICE
- Agent Eric J. Robinson
- Priority: JP 10024385 2010.02.05
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/02 ; H01L29/66 ; H01L29/786 ; H01L29/10 ; H01L29/24

Abstract:
A more convenient and highly reliable semiconductor device which has a transistor including an oxide semiconductor with higher impact resistance used for a variety of applications is provided. A semiconductor device has a bottom-gate transistor including a gate electrode layer, a gate insulating layer, and an oxide semiconductor layer over a substrate, an insulating layer over the transistor, and a conductive layer over the insulating layer. The insulating layer covers the oxide semiconductor layer and is in contact with the gate insulating layer. In a channel width direction of the oxide semiconductor layer, end portions of the gate insulating layer and the insulating layer are aligned with each other over the gate electrode layer, and the conductive layer covers a channel formation region of the oxide semiconductor layer and the end portions of the gate insulating layer and the insulating layer and is in contact with the gate electrode layer.
Public/Granted literature
- US20230022290A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-01-26
Information query
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