Invention Grant
- Patent Title: Semiconductor structure and methods of forming the same
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Application No.: US17381435Application Date: 2021-07-21
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Publication No.: US11749677B2Publication Date: 2023-09-05
- Inventor: Ta-Chun Lin , Kuo-Hua Pan , Jhon Jhy Liaw
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: NZ CARR LAW OFFICE
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234

Abstract:
A semiconductor structure includes a first semiconductor device formed over a substrate and a second semiconductor device formed over the substrate. The first semiconductor device includes a first source/drain feature over the substrate, a first gate structure over the substrate, a first conductive feature over the first source/drain feature, and a first insulation layer between the first gate structure and the first conductive feature. The second semiconductor device includes a second source/drain feature over the substrate, a second gate structure over the substrate, a second conductive feature over the second source/drain feature, and a second insulation layer between the second gate structure and the second conductive feature. A width of the first conductive feature and a width of the second conductive feature are different, and a width of the first insulation layer is less than a width of the second insulation layer.
Public/Granted literature
- US20220336448A1 SEMICONDUCTOR STRUCTURE AND METHODS OF FORMING THE SAME Public/Granted day:2022-10-20
Information query
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