- Patent Title: Semiconductor memory devices and methods of manufacturing thereof
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Application No.: US17458778Application Date: 2021-08-27
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Publication No.: US11749623B2Publication Date: 2023-09-05
- Inventor: Meng-Han Lin , Chia-En Huang
- Applicant: Taiwan Semiconductor Manfuacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H10B51/20 ; H01L23/00

Abstract:
A method for fabricating memory devices includes forming a first portion of a memory device that includes a first device portion and one or more first interface portions. The first device portion includes a plurality of first memory strings, each of which includes a plurality of first memory cells vertically separated from one another. Each of the one or more first interface portions, laterally abutted to one side of the first device portion, includes a plurality of first word lines (WLs). The method further includes forming a plurality of first source lines (SLs) and a plurality of first bit lines (BLs) in the first device portion. The method further includes forming a first seal ring structure that laterally encloses both the first device portion and the first interface portion concurrently with forming the pluralities of SLs and BLs.
Public/Granted literature
- US20220320017A1 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF Public/Granted day:2022-10-06
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