Invention Grant
- Patent Title: Dual thickness fuse structures
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Application No.: US17097432Application Date: 2020-11-13
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Publication No.: US11749599B2Publication Date: 2023-09-05
- Inventor: John J. Pekarik , Anthony K. Stamper , Vibhor Jain
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: US NY Malta
- Agency: Calderon Safran & Cole, P.C.
- Agent Anthony Canale; Andrew M. Calderon
- The original application number of the division: US15975041 2018.05.09
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/525 ; H01L21/768 ; H01L23/00 ; H01L23/62
Abstract:
The present disclosure relates to semiconductor structures and, more particularly, to dual thickness fuse structures and methods of manufacture. The structure includes a continuous wiring structure on a single wiring level and composed of conductive material having a fuse portion and a thicker wiring structure.
Public/Granted literature
- US20210066194A1 DUAL THICKNESS FUSE STRUCTURES Public/Granted day:2021-03-04
Information query
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