Invention Grant
- Patent Title: High-temperature component and method of producing the high-temperature component
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Application No.: US17431610Application Date: 2020-02-19
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Publication No.: US11746663B2Publication Date: 2023-09-05
- Inventor: Shuji Tanigawa , Koichiro Iida , Ryuta Ito , Taro Tokutake , Yoshinori Wakita
- Applicant: Mitsubishi Power, Ltd.
- Applicant Address: JP Kanagawa
- Assignee: MITSUBISHI POWER, LTD.
- Current Assignee: MITSUBISHI POWER, LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 19065817 2019.03.29
- International Application: PCT/JP2020/006559 2020.02.19
- International Announcement: WO2020/202867A 2020.10.08
- Date entered country: 2021-08-17
- Main IPC: F01D9/04
- IPC: F01D9/04 ; F01D25/12 ; F01D25/24 ; B33Y80/00

Abstract:
A high-temperature component according to an embodiment is a high-temperature component which requires cooling by a cooling medium, and includes: a plurality of cooling passages through which the cooling medium is able to flow; a header portion to which downstream ends of the plurality of first cooling passages are connected; and at least one outlet passage for discharging the cooling medium flowing into the header portion to outside of the header portion. A roughness of an inner wall surface of the at least one outlet passage is not greater than a roughness of an inner wall surface of the plurality of first cooling passages in a region where a flow-passage cross-sectional area of the outlet passage is the smallest.
Public/Granted literature
- US20220074313A1 HIGH-TEMPERATURE COMPONENT AND METHOD OF PRODUCING THE HIGH-TEMPERATURE COMPONENT Public/Granted day:2022-03-10
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