Invention Grant
- Patent Title: Film forming apparatus
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Application No.: US16113329Application Date: 2018-08-27
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Publication No.: US11745406B2Publication Date: 2023-09-05
- Inventor: Katsuyuki Nakano
- Applicant: SUMITOMO HEAVY INDUSTRIES MODERN, LTD.
- Applicant Address: JP Kanagawa
- Assignee: SUMITOMO HEAVY INDUSTRIES MODERN, LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES MODERN, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP 16063515 2016.03.28
- Main IPC: B29C48/92
- IPC: B29C48/92 ; B29C48/10 ; B29C48/08 ; B29C48/00 ; B29C48/32 ; B29C48/88 ; B29C48/325 ; B29C48/28 ; B29L23/00

Abstract:
A film forming apparatus includes a die device which extrudes a molten resin in a tube shape to form a film, a measurement unit which measures a thickness profile of a film in a circumferential direction, a plurality of adjustment portions which change the thickness profile of the film, and a controller which controls the plurality of adjustment portions such that the thickness profile approaches a target thickness profile. The controller changes the target thickness profile based on the measured thickness profile.
Public/Granted literature
- US20180361647A1 FILM FORMING APPARATUS Public/Granted day:2018-12-20
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