Invention Grant
- Patent Title: Apparatus and method for a pressure-sintering connection
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Application No.: US17861102Application Date: 2022-07-08
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Publication No.: US11745263B2Publication Date: 2023-09-05
- Inventor: Dominic Birkicht , Kurt-Georg Besendörfer , Silke Kraft , Erik Michaelsen
- Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Applicant Address: DE Nuremberg
- Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Current Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Current Assignee Address: DE Nuremberg
- Agency: NOLTE LACKENBACH SIEGEL
- Agent Andrew F. Young
- Priority: DE 2021118948.9 2021.07.22
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B22F7/06 ; B22F3/14 ; B23K20/02

Abstract:
A method and an apparatus for the pressure-sintering connection of a first and a second connection provide a frame element lowerable onto a frame surface surrounding the supporting surface, having a sintering ram lowerable lowered from the normal direction onto the second connection partner and exerts pressure thereon, and converting a sintering paste between the connection partners into a sintered metal, and having an auxiliary apparatus for the arrangement of a separating film for the peripheral covering of the frame surface and the connection partners. This arrangement of the separating film produces an inner region bounded by the frame element and bounded by a separating film portion within the frame element and by the supporting surface, and injection opening and an outlet opening allow a second gas to flush through said inner region from the injection opening to the outlet opening and displace a first gas.
Public/Granted literature
- US20230023512A1 APPARATUS AND METHOD FOR A PRESSURE-SINTERING CONNECTION Public/Granted day:2023-01-26
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