Invention Grant
- Patent Title: Semiconductor memory device and manufacturing method thereof
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Application No.: US17854803Application Date: 2022-06-30
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Publication No.: US11723205B2Publication Date: 2023-08-08
- Inventor: Sung Wook Jung
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR 20200042389 2020.04.07
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H01L23/535 ; H10B41/10 ; H10B41/27 ; H10B41/35 ; H10B41/41 ; H10B41/50 ; H10B43/10 ; H10B43/35 ; H10B43/40 ; H10B43/50 ; H10B63/00 ; H10N70/20

Abstract:
There are provided a semiconductor memory device and a manufacturing method thereof. The semiconductor memory device includes a first select group and a second select group isolated from each other by an isolation insulating layer; an upper gate stack structure extending to overlap with the first select group, the isolation insulating layer, and the second select group; channel structures extending to penetrate the first select group, the second select group, and the upper gate stack structure; and a vertical connection structure spaced apart from the first select group, the second select group, and the upper gate stack structure, the vertical connection structure extending in parallel to the channel structures.
Public/Granted literature
- US20220336495A1 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-10-20
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