A semiconductor package includes a die pad comprising a die attach surface, a first lead extending away from the die pad, one or more semiconductor dies mounted on the die attach surface, the one or more semiconductor dies comprising first and second bond pads that each face away from the die attach surface, and a distribution element that provides a first transmission path for a first electrical signal between the first lead and the first bond pad of the one or more semiconductor dies and a second transmission path for the first electrical signal between the first lead and the second bond pad of the one or more semiconductor dies. The distribution element comprises at least one integrally formed circuit element that creates a difference in transmission characteristics between the first and second transmission paths.