Invention Grant
- Patent Title: Multilayer capacitor and board having the same mounted thereon
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Application No.: US17697172Application Date: 2022-03-17
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Publication No.: US11694847B2Publication Date: 2023-07-04
- Inventor: Sim Chung Kang , Yong Park , Woo Chul Shin , Ki Pyo Hong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190100294 2019.08.16
- Main IPC: H01G2/06
- IPC: H01G2/06 ; H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/30

Abstract:
A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.
Public/Granted literature
- US20220208475A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2022-06-30
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