Invention Grant
- Patent Title: Method of preparing bonded magnet and bonded magnet
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Application No.: US16728320Application Date: 2019-12-27
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Publication No.: US11694826B2Publication Date: 2023-07-04
- Inventor: Takashi Asada , Shuichi Tada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Hunton Andrews Kurth LLP
- Priority: JP 19228312 2019.12.18
- Main IPC: H01F1/059
- IPC: H01F1/059 ; H01F1/055 ; H01F1/20

Abstract:
The present disclosure aims to provide a bonded magnet having good magnetic properties and a method of preparing the bonded magnet. The present disclosure provides a method of preparing a bonded magnet, including: a first compression step of compressing a magnetic powder having an average particle size of 10 μm or less while magnetically orienting it to obtain a first molded article; a second compression step of bringing the first molded article into contact with a thermosetting resin having a viscosity of 200 mPa·s or less, followed by compression to obtain a second molded article; and a heat treatment step of heat treating the second molded article.
Public/Granted literature
- US20200211742A1 METHOD OF PREPARING BONDED MAGNET AND BONDED MAGNET Public/Granted day:2020-07-02
Information query
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