Invention Grant
- Patent Title: Method of manufacturing composite circuit board
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Application No.: US17497815Application Date: 2021-10-08
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Publication No.: US11672083B2Publication Date: 2023-06-06
- Inventor: Yang Li , Yan-Lu Li
- Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
- Applicant Address: CN Qinhuangdao
- Assignee: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,Avary Holding (Shenzhen) Co., Limited.
- Current Assignee: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,Avary Holding (Shenzhen) Co., Limited.
- Current Assignee Address: CN Qinhuangdao; CN Shenzhen
- Agency: ScienBiziP, P.C.
- Priority: CN 2010146448.X 2020.03.05
- The original application number of the division: US17030521 2020.09.24
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K1/14 ; H05K1/18 ; H05K3/02 ; H05K3/06 ; H05K3/10 ; H05K3/14 ; H05K3/34 ; H05K3/36 ; H05K3/46 ; H01L21/02 ; H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/56 ; H01L21/68 ; H01L23/02 ; H01L23/12 ; H01L23/14 ; H01L23/24 ; H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L23/498 ; H01L23/552 ; H05K3/32 ; H05K3/00
Abstract:
A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.
Public/Granted literature
- US20220030723A1 METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD Public/Granted day:2022-01-27
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