- Patent Title: Heat dissipation and sealing configuration for junction assembly
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Application No.: US17337160Application Date: 2021-06-02
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Publication No.: US11670929B2Publication Date: 2023-06-06
- Inventor: Jacob Pfeifer
- Applicant: Schaeffler Technologies AG & Co. KG
- Applicant Address: DE Herzogenaurach
- Assignee: Schaeffler Technologies AG & Co. KG
- Current Assignee: Schaeffler Technologies AG & Co. KG
- Current Assignee Address: DE Herzogenaurach
- Agency: Volpe Koenig, P.C.
- Main IPC: H02G5/10
- IPC: H02G5/10 ; H02G5/08

Abstract:
A junction assembly is disclosed herein. The junction assembly includes a junction housing configured to support a phase bar assembly. A heatsink contacts at least a portion of the junction housing and a busbar is arranged adjacent to the junction housing. At least one fastener attaches the junction housing, the heatsink, and the busbar to each other. At least one heatsink seal is provided at an interface defined between the heatsink and the junction housing.
Public/Granted literature
- US20220393453A1 HEAT DISSIPATION AND SEALING CONFIGURATION FOR JUNCTION ASSEMBLY Public/Granted day:2022-12-08
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