Invention Grant
- Patent Title: Semiconductor device structure and method for manufacturing the same
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Application No.: US17366439Application Date: 2021-07-02
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Publication No.: US11670712B2Publication Date: 2023-06-06
- Inventor: Zhongping Liao
- Applicant: Silergy Semiconductor Technology (Hangzhou) LTD
- Applicant Address: CN Hangzhou
- Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
- Current Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
- Current Assignee Address: CN Hangzhou
- Priority: CN 1410578050.8 2014.10.24
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/78 ; H01L29/66 ; H01L29/40 ; H01L29/739

Abstract:
A semiconductor device structure can include: (i) a first semiconductor layer having dopants of a first type; (ii) a second semiconductor layer having the dopants of the first type on the first semiconductor layer, where the second semiconductor layer is lightly-doped relative to the first semiconductor layer; (iii) first and second column regions spaced from each other in the second semiconductor layer, where the second column region is arranged between two of the first column regions; and (iv) first and second first sub-column regions laterally arranged in the second column region, where a doping concentration of the first sub-column region decreases in a direction from the first column region to the second sub-column region, and where a doping concentration of the second sub-column region decreases in a direction from the first column region to the first sub-column region.
Public/Granted literature
- US20210336053A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-10-28
Information query
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