Invention Grant
- Patent Title: Semiconductor devices
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Application No.: US17019767Application Date: 2020-09-14
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Publication No.: US11670701B2Publication Date: 2023-06-06
- Inventor: Seungchan Yun , Donghwan Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR 20190169763 2019.12.18
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/10

Abstract:
A semiconductor device including a substrate including first and second regions, a first transistor on the first region and including a first semiconductor pattern protruding from the first region; a first gate structure covering an upper surface and sidewall of the first semiconductor pattern; first source/drain layers on the first semiconductor pattern at opposite sides of the first gate structure, upper surfaces of the first source/drain layers being closer to the substrate than an uppermost surface of the first gate structure; and a second transistor on the second region and including a second semiconductor pattern protruding from the second region; a second gate structure covering a sidewall of the second semiconductor pattern; and a second source/drain layer under the second semiconductor pattern; and a third source/drain layer on the second semiconductor pattern, wherein the upper surface of the first region is lower than the upper surface of the second region.
Public/Granted literature
- US20210193818A1 SEMICONDUCTOR DEVICES Public/Granted day:2021-06-24
Information query
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