Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17111525Application Date: 2020-12-04
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Publication No.: US11670675B2Publication Date: 2023-06-06
- Inventor: Narumi Ohkawa
- Applicant: United Semiconductor Japan Co., Ltd.
- Applicant Address: JP Kuwana
- Assignee: United Semiconductor Japan Co., Ltd.
- Current Assignee: United Semiconductor Japan Co., Ltd.
- Current Assignee Address: JP Kuwana
- Agent Winston Hsu
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a semiconductor substrate, a fin-shaped structure, a gate structure, a first doped region, a second doped region, and an intermediate region. The fin-shaped structure is disposed on and extends upwards from a top surface of the semiconductor substrate in a vertical direction. The gate structure is disposed straddling a part of the fin-shaped structure. At least a part of the first doped region is disposed in the fin-shaped structure. The second doped region is disposed in the fin-shaped structure and disposed above the first doped region in the vertical direction. The intermediate region is disposed in the fin-shaped structure. The second doped region is separated from the first doped region by the intermediate region, and a bottom surface of the gate structure is lower than or coplanar with a top surface of the first doped region in the vertical direction.
Public/Granted literature
- US20220181437A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-06-09
Information query
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