Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17147542Application Date: 2021-01-13
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Publication No.: US11670673B2Publication Date: 2023-06-06
- Inventor: Hyun-suk Lee , Ji-won Yu , Ji-woon Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20160088706 2016.07.13
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L27/108 ; H01L27/10

Abstract:
A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.
Public/Granted literature
- US20210159310A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-05-27
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