Invention Grant
- Patent Title: Micro LED device and method of manufacturing the same
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Application No.: US16922147Application Date: 2020-07-07
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Publication No.: US11670667B2Publication Date: 2023-06-06
- Inventor: Joohun Han , Junhee Choi , Kiho Kong , Jinjoo Park , Nakhyun Kim , Junghun Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20190131387 2019.10.22
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/15

Abstract:
A micro light emitting diode (LED) device and a method of manufacturing the same are provided. A micro LED device includes a light emitting layer that is provided on a support substrate, a bonding layer, and a driver layer. The light emitting layer includes a stacked structure including a first semiconductor layer, an active layer, and a second semiconductor layer; first and second electrodes provided on a first side and a second side of the stacked structure; and a plurality of light emitting regions. The bonding layer is positioned between the support substrate and the light emitting layer. The drive layer includes a drive element electrically connected to the light emitting layer and is positioned on the light emitting layer to apply power to the plurality of light emitting regions of the light emitting layer.
Public/Granted literature
- US20210118944A1 MICRO LED DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-04-22
Information query
IPC分类: