Aspects of the present disclosure relate to a light-emitting system comprising a plurality of LEDs having relatively small nearest-neighbor distances (e.g., a close-packed array of LEDs). In some cases, one or more LEDs of the plurality of LEDs comprise a via between a semiconductor layer (e.g., an n-type semiconductor layer forming part of a p-n junction) and a heat dissipation substrate. The presence of the vias may advantageously reduce or eliminate current crowding and may allow the LEDs to be operated at a high current density (e.g., at least 1A/mm2). In some cases, one or more LEDs of the plurality of LEDs comprise a first contact pad (e.g., an n-side contact pad) and a second contact pad (e.g., a p-side contact pad) positioned in any location, which may allow the LEDs to be configured in series or in parallel, or to be individually addressable. The first and second contact pads of the LEDs may be electrically connected to other elements of the light-emitting system (e.g., other LEDs, an anode, a cathode, a busbar) via one or more wire bonds, and at least a portion of the one or more wire bonds may be positioned outside light emission areas of the LEDs. Additionally, the light-emitting system may further comprise one or more anodes and one or more cathodes positioned in any location. In some cases, one or more LEDs of the plurality of LEDs are mounted on a substrate (e.g., a printed circuit board, a lead frame substrate, a composite substrate) that is electrically isolated from any anodes or cathodes of the light-emitting system.