Invention Grant
- Patent Title: Method for fabricating semiconductor device
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Application No.: US17577549Application Date: 2022-01-18
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Publication No.: US11670636B2Publication Date: 2023-06-06
- Inventor: Tae Yong Kwon , Byoung-Gi Kim , Ki Hwan Lee , Jung Han Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20190057279 2019.05.16
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a substrate having first and second regions, first fin groups spaced along a first direction on the first region, each of the first fin groups including adjacent first and second fins having longitudinal directions in a second direction intersecting the first direction, and third to fifth fins spaced along a third direction on the second region, the third to fifth fins having longitudinal directions in a fourth direction intersecting the third direction. The third through fifth fins are at a first pitch, the first and second fins are at a second pitch equal to or smaller than the first pitch, each of the first fin groups is at a first group pitch greater than three times the first pitch and smaller than four times the first pitch, and a width of the first and second fins is same as width of the third fin.
Public/Granted literature
- US20220139912A1 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2022-05-05
Information query
IPC分类: