Invention Grant
- Patent Title: Semiconductor device and semiconductor module
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Application No.: US17938592Application Date: 2022-10-06
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Publication No.: US11670633B2Publication Date: 2023-06-06
- Inventor: Yuki Nakano
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP 1526756 2015.02.13
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/16 ; H01L23/34 ; H01L29/66 ; H01L29/861 ; H01L29/06 ; H01L29/20
Abstract:
The semiconductor device of the present invention includes a semiconductor substrate, a switching element which is defined on the semiconductor substrate, and a temperature sense element which is provided on the surface of the semiconductor substrate independently from the switching element and characterized by being dependent on a temperature.
Public/Granted literature
- US20230025858A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE Public/Granted day:2023-01-26
Information query
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