Invention Grant
- Patent Title: Wafer observation apparatus and wafer observation method
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Application No.: US16908386Application Date: 2020-06-22
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Publication No.: US11670528B2Publication Date: 2023-06-06
- Inventor: Naoaki Kondo , Minoru Harada , Yohei Minekawa , Takehiro Hirai
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge, P.C.
- Priority: JP 2019118345 2019.06.26
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G06T7/00 ; H01L21/66

Abstract:
Provided is a wafer observation apparatus includes: a scanning electron microscope; a control unit which includes a wafer observation unit that observes a wafer of a semiconductor device, and an image acquisition unit that acquires a wafer image; a storage unit which includes an image storage unit that stores the wafer image and a template image, and a recipe storage unit that stores a wafer alignment recipe including a matching success and failure determination threshold value, an image processing parameter set, and a use priority associated with the template image; and a calculation unit which includes a recipe reading unit that reads the template image and the wafer alignment recipe, a recipe update necessity determination unit that determines update necessity of the wafer alignment recipe, and a recipe updating unit that updates the wafer alignment recipe based on a determination result in the recipe update necessity determination unit.
Information query
IPC分类: