Invention Grant
- Patent Title: Inductor component and inductor component mounting substrate
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Application No.: US17076609Application Date: 2020-10-21
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Publication No.: US11670445B2Publication Date: 2023-06-06
- Inventor: Yoshimasa Yoshioka , Kouji Yamauchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 2019194117 2019.10.25
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/255 ; H01F27/32 ; H01F27/29 ; H05K1/18

Abstract:
An inductor component includes first and second inductor wiring lines, a first vertical wiring line, a second vertical wiring line, and a third vertical wiring line, wherein the first vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the first inductor wiring line, respectively, and the third vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the second inductor wiring line, respectively.
Public/Granted literature
- US20210125770A1 INDUCTOR COMPONENT AND INDUCTOR COMPONENT MOUNTING SUBSTRATE Public/Granted day:2021-04-29
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