Invention Grant
- Patent Title: Trimming method
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Application No.: US17356591Application Date: 2021-06-24
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Publication No.: US11670388B2Publication Date: 2023-06-06
- Inventor: Hideaki Katakura
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP 2020143045 2020.08.26
- Main IPC: G11C17/16
- IPC: G11C17/16 ; G11C29/02 ; G11C17/18

Abstract:
A trimming method for adjusting electrical characteristics of an adjustment circuit, which is provided in a semiconductor substrate, by cutting a fuse resistor provided in the semiconductor substrate. In a case where a cutting current flows to the fuse resistor to cut the fuse resistor, at least one of switching devices provided in the semiconductor substrate is set to a conductible state to make the cutting current flow to the switching device.
Public/Granted literature
- US20220068414A1 TRIMMING METHOD Public/Granted day:2022-03-03
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