Invention Grant
- Patent Title: Sub-word line driver placement for memory device
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Application No.: US17687272Application Date: 2022-03-04
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Publication No.: US11670362B2Publication Date: 2023-06-06
- Inventor: Yi-Tzu Chen , Ching-Wei Wu , Hau-Tai Shieh , Hung-Jen Liao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Foley & Lardner LLP
- Main IPC: G11C11/40
- IPC: G11C11/40 ; G11C11/408 ; G11C5/02 ; G11C5/06 ; G11C11/4093

Abstract:
Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.
Public/Granted literature
- US20220199145A1 SUB-WORD LINE DRIVER PLACEMENT FOR MEMORY DEVICE Public/Granted day:2022-06-23
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