Invention Grant
- Patent Title: Three dimensional printed mold for electrochemical sensor fabrication, method and related system and devices thereof
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Application No.: US16314492Application Date: 2017-08-16
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Publication No.: US11666263B2Publication Date: 2023-06-06
- Inventor: Cheng Yang , B. Jill Venton , Elefterios Trikantzopoulos
- Applicant: University of Virginia Patent Foundation
- Applicant Address: US VA Charlottesville
- Assignee: University of Virginia Patent Foundation
- Current Assignee: University of Virginia Patent Foundation
- Current Assignee Address: US VA Charlottesville
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- International Application: PCT/US2017/047168 2017.08.16
- International Announcement: WO2018/035238A 2018.02.22
- Date entered country: 2018-12-31
- Main IPC: A61B5/291
- IPC: A61B5/291 ; A61B5/283 ; H01B3/30 ; H01B1/24 ; A61B5/24 ; H01B1/02 ; H01B1/04 ; H01B5/14

Abstract:
A method for preparing microsensors (e.g., microelectrodes) suitable for use in electrophysiology and electrochemistry studies in vitro and in vivo is described. The method can involve preparing a polymeric resin-insulated electron conducting fiber using a 3D printed mold comprising one or more channels, wherein each of the channels includes a tapered section. An electron conducting fiber partially enclosed within a metal or glass support can be laid in a channel; and a polymeric resin can be poured into the channel and cured, providing a polymer-insulated electron conducting fiber having a tapered section in proximity to a polymer-free electroactive tip area. For example, the method can be used to provide a polyimide-insulated carbon fiber microsensor. The mold can be used for the batch fabrication of the microsensors. The microsensors themselves, the molds for making the microsensors, and methods of using the microsensors are also described.
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