Invention Grant
- Patent Title: Memory array, semiconductor chip and manufacturing method of memory array
-
Application No.: US17382372Application Date: 2021-07-22
-
Publication No.: US11647682B2Publication Date: 2023-05-09
- Inventor: Yu-Chao Lin , Jung-Piao Chiu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A memory array, a semiconductor chip and a method for forming the memory array are provided. The memory array includes first signal lines, second signal lines and memory cells. The first signal lines extend along a first direction. The second signal lines extend along a second direction over the first signal lines. The memory cells are defined at intersections of the first and second signal lines, and respectively include a resistance variable layer, a switching layer, an electrode layer and a carbon containing dielectric layer. The switching layer is overlapped with the resistance variable layer. The electrode layer lies between the resistance variable layer and the switching layer. The carbon containing layer laterally surrounds a stacking structure including the resistance variable layer, the switching layer and the electrode layer.
Public/Granted literature
- US20220367796A1 MEMORY ARRAY, SEMICONDUCTOR CHIP AND MANUFACTURING METHOD OF MEMORY ARRAY Public/Granted day:2022-11-17
Information query
IPC分类: