Invention Grant
- Patent Title: Semiconductor structure having fin structures and method of manufacturing the same
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Application No.: US17066923Application Date: 2020-10-09
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Publication No.: US11647622B2Publication Date: 2023-05-09
- Inventor: Min-Chung Cheng
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/308 ; H01L21/3065

Abstract:
The present disclosure provides a semiconductor structure having a fin structure and a method of manufacturing the semiconductor structure. The semiconductor includes a substrate defined with an active region. A first gate structure is disposed in the active region and includes a dielectric material. A second gate structure is disposed in the active region and includes the dielectric material. A fin structure having a first top surface is arranged to alternate with the first gate structure and the second gate structure. The first gate structure has a second top surface and the second gate structure has a third top surface. The second top surface and the third top surface are lower than the first top surface.
Public/Granted literature
- US20220115381A1 SEMICONDUCTOR STRUCTURE HAVING FIN STRUCTURES AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-04-14
Information query
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