Invention Grant
- Patent Title: Junction barrier Schottky diode device and method for fabricating the same
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Application No.: US17317100Application Date: 2021-05-11
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Publication No.: US11646382B2Publication Date: 2023-05-09
- Inventor: Nobuo Machida , Wen-Tsung Chang , Wen-Chin Wu
- Applicant: Taipei ANJET Corporation
- Applicant Address: TW Taipei
- Assignee: TAIPEI ANJET CORPORATION
- Current Assignee: TAIPEI ANJET CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/872 ; H01L29/47 ; H01L21/285 ; H01L21/443 ; H01L29/66 ; H01L29/16 ; H01L29/20 ; H01L29/24 ; H01L21/04

Abstract:
A junction barrier Schottky diode device and a method for fabricating the same is disclosed. In the junction barrier Schottky device includes an N-type semiconductor layer, a plurality of first P-type doped areas, a plurality of second P-type doped areas, and a conductive metal layer. The first P-type doped areas and the second P-type doped are formed in the N-type semiconductor layer. The second P-type doped areas are self-alignedly formed above the first P-type doped areas. The spacing between every neighboring two of the second P-type doped areas is larger than the spacing between every neighboring two of the first P-type doped areas. The conductive metal layer, formed on the N-type semiconductor layer, covers the first P-type doped areas and the second P-type doped areas.
Public/Granted literature
- US20220367731A1 JUNCTION BARRIER SCHOTTKY DIODE DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2022-11-17
Information query
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