A method for making a super junction device includes the following steps: step 1: forming a trench gate, in the forming process of the trench gate, a polysilicon gate being used to fill gate trenches and then first flattening being performed and the width of the gate trench at the leading-out position of the gate structure satisfies the requirement of forming contacts; and step 2: forming a super junction, in the forming process of the super junction, a second epitaxial layer being used to fill a super junction trench and then second flattening being performed. The method can realize an all flat process, can conveniently arrange the trench gate process before the forming process of the super junction, can decrease the thermal processes after the formation of the super junction, can save the mask and can decrease the process cost.