Invention Grant
- Patent Title: Light-receiving device, method of manufacturing light-receiving device, and electronic apparatus
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Application No.: US16340305Application Date: 2017-10-06
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Publication No.: US11646341B2Publication Date: 2023-05-09
- Inventor: Yoshifumi Zaizen , Shunsuke Maruyama
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JP 2016220762 2016.11.11
- International Application: PCT/JP2017/036431 2017.10.06
- International Announcement: WO2018/088083A 2018.05.17
- Date entered country: 2019-04-08
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0304 ; H01L31/109 ; H01L31/18 ; A61B1/04 ; B60W50/00 ; H04N5/33

Abstract:
A light-receiving device of an embodiment of the present disclosure includes a photoelectric conversion layer that includes a first compound semiconductor with a first conductivity type and absorbs a wavelength of an infrared region, a first semiconductor layer formed on the photoelectric conversion layer, and an insulation layer formed to surround the photoelectric conversion layer and the first semiconductor layer, the first semiconductor layer having a second conductivity-type region at a middle region excluding a periphery facing the photoelectric conversion layer.
Public/Granted literature
- US20190319055A1 LIGHT-RECEIVING DEVICE, METHOD OF MANUFACTURING LIGHT-RECEIVING DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2019-10-17
Information query
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