The present disclosure provides a package structure and a packaging method. The package structure provided by the present disclosure includes: a package base and a redistribution layer disposed on the package base; where the package base includes a plurality of device areas; and a channel set is provided in the device area, where the channel set is used to connect an electronic device, and the redistribution layer is used to lead a subset of to-be-protected channels that needs electrostatic protection in the channel set out to a preset area on the package base, so that all or part of channels in the subset of to-be-protected channels form a series circuit in the preset area, and the series circuit is used to connect with an electrostatic discharge end. The package structure of the present disclosure can provide electrostatic protection for the channel that needs to be protected during a packaging process.