Invention Grant
- Patent Title: Measuring device, measuring method, and semiconductor storage device
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Application No.: US17189738Application Date: 2021-03-02
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Publication No.: US11646211B2Publication Date: 2023-05-09
- Inventor: Hiroyuki Tanizaki
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 2020142878 2020.08.26
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/311 ; H01L27/11582 ; H01L27/11529 ; H01L27/11573 ; H01L23/522 ; G01B15/02 ; G01B15/04 ; G01B17/06 ; G06T7/00 ; G06T7/564 ; H01L21/66 ; H01L27/11556

Abstract:
A measuring device includes a measuring stage on which a subject is placed, an X-ray irradiation unit, an X-ray detection unit that detects scattered X-rays generated from the subject and an analysis unit that analyzes the diffraction image obtained by photo-electrically converting scattered X-rays and presumes (estimates) the three-dimensional shape of the subject. In the subject, holes are formed in the ON stack film from the opening of the etching mask film formed on the ON stack film. The analysis unit presumes the three-dimensional shape of the subject based a plurality of the diffraction images acquired while changing a rotation angle of the measuring stage and the measurement data of the subject by at least one of measuring methods of a multi-wavelength light measurement and a laser ultrasonic wave measurement.
Public/Granted literature
- US20220068678A1 MEASURING DEVICE, MEASURING METHOD, AND SEMICONDUCTOR STORAGE DEVICE Public/Granted day:2022-03-03
Information query
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