- Patent Title: Ultrathin atomic layer deposition film accuracy thickness control
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Application No.: US17305938Application Date: 2021-07-16
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Publication No.: US11646198B2Publication Date: 2023-05-09
- Inventor: Jun Qian , Hu Kang , Adrien LaVoie , Seiji Matsuyama , Purushottam Kumar
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: C23C16/40
- IPC: C23C16/40 ; H01L21/02 ; H01J37/32 ; C23C16/455 ; C23C16/02
Abstract:
Methods for depositing films by atomic layer deposition using aminosilanes are provided.
Public/Granted literature
- US20210343520A1 ULTRATHIN ATOMIC LAYER DEPOSITION FILM ACCURACY THICKNESS CONTROL Public/Granted day:2021-11-04
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