Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16370744Application Date: 2019-03-29
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Publication No.: US11646151B2Publication Date: 2023-05-09
- Inventor: Atsuo Hirukawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 2018071002 2018.04.02
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/00

Abstract:
A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers and including a coil built therein, and first and second outer electrodes electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors stacked together with the insulating layers. The multilayer coil component further includes, inside the multilayer body, first and second connecting conductors. The first connecting conductor connects between a portion of the first outer electrode covering the first end face, and a coil conductor facing the portion. The second connecting conductor connects between a portion of the second outer electrode covering the second end face, and a coil conductor facing the portion. With respect to the length direction, the coil has a length from about 85.0% to about 94.0% of the length of the multilayer body.
Public/Granted literature
- US20190304667A1 MULTILAYER COIL COMPONENT Public/Granted day:2019-10-03
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