To provide an adhesive suitable to bond a component of an electronic apparatus or an optical apparatus, as well as an electronic apparatus and an optical apparatus in which the adhesive is used. An adhesive according to an embodiment of the present technology includes a flexible adhesive material and a plurality of particles. The adhesive material is flexible. The plurality of particles is dispersed in the adhesive material, the plurality of particles being deformed under a low-rate load and not being deformed under a high-rate load.