Invention Grant
- Patent Title: Resin composition and resin molded product
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Application No.: US16854882Application Date: 2020-04-21
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Publication No.: US11643526B2Publication Date: 2023-05-09
- Inventor: Kenji Yao , Hideaki Yoshikawa
- Applicant: FUJIFILM Business Innovation Corp.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP 2019198825 2019.10.31
- Main IPC: C08L1/12
- IPC: C08L1/12 ; C08K5/13 ; C08L1/14

Abstract:
A resin composition includes a cellulose acylate (A); and an aromatic compound (B) not containing a functional group that reacts with the cellulose acylate (A), but containing a long-chain aliphatic group and at least one of a phenolic hydroxy group and a monoglycidyl ether group directly bonded to an aromatic group of the aromatic compound (B), in which a mass ratio (B)/(A) of the aromatic compound (B) to the cellulose acylate (A) is 0.15 or more.
Public/Granted literature
- US20210130587A1 RESIN COMPOSITION AND RESIN MOLDED PRODUCT Public/Granted day:2021-05-06
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