The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature.
A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan δ=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×105 Pa or less after curing.
Component (A): urethane-modified (meth)acrylate oligomer
Component (B): film forming agent
Component (C): photoinitiator