Invention Grant
- Patent Title: System and method for manufacturing microneedle assemblies with medicaments
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Application No.: US17214029Application Date: 2021-03-26
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Publication No.: US11642855B2Publication Date: 2023-05-09
- Inventor: Seemit Praharaj , Chu-Heng Liu , Douglas K. Herrmann , Jason M. LeFevre , Paul J. McConville
- Applicant: Xerox Corporation
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Maginot Moore & Beck LLP
- Main IPC: B29C64/40
- IPC: B29C64/40 ; B29C64/118 ; B29C64/245 ; B29C64/209 ; B33Y30/00 ; B33Y10/00

Abstract:
An additive manufacturing system has an extruder and a printhead module with a conveyor for moving between the extruder and the printhead module. The extruder is operated to form a support layer having microneedle protrusions. The conveyor moves the support layer having the microneedle protrusions to a position opposite the printhead module for sharpening of the microneedle protrusions and the application of a medicament to the sharpened microneedle protrusions.
Public/Granted literature
- US20220305736A1 SYSTEM AND METHOD FOR MANUFACTURING MICRO-NEEDLE ASSEMBLIES WITH MEDICAMENTS Public/Granted day:2022-09-29
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