Invention Grant
- Patent Title: Wire-assembly apparatus for invasive biosensors
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Application No.: US16890901Application Date: 2020-06-02
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Publication No.: US11642054B2Publication Date: 2023-05-09
- Inventor: Ohseung Kwon , Xianyan Wang , Timothy Stowe
- Applicant: DexCom, Inc.
- Applicant Address: US CA San Diego
- Assignee: DexCom, Inc.
- Current Assignee: DexCom, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Snell & Wilmer, LLP
- Main IPC: A61B5/145
- IPC: A61B5/145 ; A61B5/1473 ; A61B5/00

Abstract:
In some aspects, an apparatus for a biosensor includes a sensor wire and a rigid member. The rigid member may be coupled to the sensor wire and include a contact surface. The contact surface may be sized to enable a suction head of a robotic placement device to create a vacuum seal on the contact surface for lifting the sensor wire and rigid member.
Public/Granted literature
- US20200297254A1 WIRE-ASSEMBLY APPARATUS FOR INVASIVE BIOSENSORS Public/Granted day:2020-09-24
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