Invention Grant
- Patent Title: Self-rectifying resistive memory and fabrication method thereof
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Application No.: US16767091Application Date: 2018-03-28
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Publication No.: US11641787B2Publication Date: 2023-05-02
- Inventor: Qing Luo , Hangbing Lv , Ming Liu
- Applicant: Institute of Microelectronics, Chinese Academy of Sciences
- Applicant Address: CN Beijing
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: Davis Wright Tremaine LLP
- Agent Michael J. Donohue
- International Application: PCT/CN2018/080852 WO 20180328
- International Announcement: WO2019/183828 WO 20191003
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H01L45/00

Abstract:
The present disclosure provides a self-rectifying resistive memory, including: a lower electrode; a resistive material layer formed on the lower electrode and used as a storage medium; a barrier layer formed on the resistive material layer and using a semiconductor material or an insulating material; and an upper electrode formed on the barrier layer to achieve Schottky contact with the material of the barrier layer; wherein, the Schottky contact between the upper electrode and the material of the barrier layer is used to realize self-rectification of the self-rectifying resistive memory. Thus, no additional gate transistor or diode is required as the gate unit. In addition, because the device has self-rectifying characteristics, it is capable of suppressing read crosstalk in the cross-array.
Public/Granted literature
- US20210013404A1 SELF-RECTIFYING RESISTIVE MEMORY AND FABRICATION METHOD THEREOF Public/Granted day:2021-01-14
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