Invention Grant
- Patent Title: Semiconductor devices
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Application No.: US17501149Application Date: 2021-10-14
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Publication No.: US11641743B2Publication Date: 2023-05-02
- Inventor: Kwangyoung Jung , Jongwon Kim , Dongseog Eun , Joonhee Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2017-0094394 20170725
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11568 ; H01L21/768 ; H01L23/522 ; H01L23/528 ; H01L27/11565 ; H01L27/11575

Abstract:
Semiconductor devices are provided. A semiconductor device includes a substrate. The semiconductor device includes a stack structure including conductive layers stacked on the substrate. Moreover, the semiconductor device includes a dummy structure penetrating a stepped region of the stack structure. A portion of the dummy structure includes a first segment and a second segment. The first segment extends in a first direction in a plane parallel to an upper surface of the substrate. The second segment protrudes from the first segment in a second direction, in the plane, that intersects the first direction.
Public/Granted literature
- US20220037347A1 SEMICONDUCTOR DEVICES Public/Granted day:2022-02-03
Information query
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