• Patent Title: Connecting thermally-sprayed layer structures of heating devices
  • Application No.: US15747171
    Application Date: 2016-07-01
  • Publication No.: US11641698B2
    Publication Date: 2023-05-02
  • Inventor: Stefan KoblerRobert KühnPhilipp Schaller
  • Applicant: BSH Hausgeräte GmbH
  • Applicant Address: DE Munich
  • Assignee: BSH Hausgeräte GmbH
  • Current Assignee: BSH Hausgeräte GmbH
  • Current Assignee Address: DE Munich
  • Agent Michael E. Tschupp; Andre Pallapies; Brandon G. Braun
  • Priority: DE102015214627.8 20150731
  • International Application: PCT/EP2016/065541 WO 20160701
  • International Announcement: WO2017/021076 WO 20170209
  • Main IPC: H05B3/26
  • IPC: H05B3/26 H05B3/22
Connecting thermally-sprayed layer structures of heating devices
Abstract:
A heating device for a domestic appliance includes a planar carrier having a carrier surface. Thermally sprayed onto the carrier surface is a layer structure, and a first solder volume is applied to the layer structure. The solder volume is an ultrasonically soldered-on solder volume. The layer structure can hereby be a heating conductor layer.
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