Invention Grant
- Patent Title: High-power laser packaging utilizing carbon nanotubes between metallic bonding materials
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Application No.: US17173337Application Date: 2021-02-11
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Publication No.: US11641092B2Publication Date: 2023-05-02
- Inventor: Won Tae Lee , Michael Deutsch , Zhongyong Liu
- Applicant: TERADIODE, INC.
- Applicant Address: US MA Wilmington
- Assignee: TERADIODE, INC.
- Current Assignee: TERADIODE, INC.
- Current Assignee Address: US MA Wilmington
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: G02B5/18
- IPC: G02B5/18 ; G02B7/18 ; G02B27/44 ; H01S5/0237 ; H01S5/024 ; H01S5/40 ; H01S5/14 ; H01S5/0236 ; H01S5/02345
Abstract:
In various embodiments, laser devices include a thermal bonding layer featuring an array of carbon nanotubes and at least one metallic thermal bonding material.
Public/Granted literature
- US20210257810A1 HIGH-POWER LASER PACKAGING UTILIZING CARBON NANOTUBES Public/Granted day:2021-08-19
Information query
