Invention Grant
- Patent Title: Method and device for controlling operation using temperature deviation in multi-chip
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Application No.: US17679410Application Date: 2022-02-24
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Publication No.: US11640955B2Publication Date: 2023-05-02
- Inventor: Min-Sang Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2015-0049952 20150408
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/34 ; G06F13/00 ; G11C11/406 ; H01L25/18 ; H01L23/00
Abstract:
A multi-chip package includes a first die having temperature sensors and a second die. The first die generates temperature deviation information of m (m
Public/Granted literature
- US20220181302A1 METHOD AND DEVICE FOR CONTROLLING OPERATION USING TEMPERATURE DEVIATION IN MULTI-CHIP Public/Granted day:2022-06-09
Information query
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