Invention Grant
- Patent Title: Electromagnetic relay
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Application No.: US17497978Application Date: 2021-10-11
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Publication No.: US11640890B2Publication Date: 2023-05-02
- Inventor: Ayaka Miyake , Shinya Yamamoto , Daisuke Otsubo
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Shinjyu Global IP
- Priority: JPJP2020-176211 20201020
- Main IPC: H01H3/00
- IPC: H01H3/00 ; H01H50/64 ; H01H50/54 ; H01H50/14

Abstract:
An electromagnetic relay includes a first movable contact piece, a moving member, a coil, and a movable iron core. The moving member holds the first movable contact piece. The movable iron core is connected to the moving member and is configured to move by a magnetic force generated by the coil. The moving member is made of resin having electrical insulation. The moving member includes a first member and a second member. The second member is connected to the first member by snap fitting. The first member includes a first protrusion. The second member includes a second main body, a first locking portion, and a first arm. The first locking portion locks to the first protrusion. The first arm connects the second main body and the first locking portion. A thickness of the first arm is smaller than a thickness of the first locking portion.
Public/Granted literature
- US20220122797A1 ELECTROMAGNETIC RELAY Public/Granted day:2022-04-21
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