Invention Grant
- Patent Title: Substrate for magnetic disk and magnetic disk
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Application No.: US17266079Application Date: 2019-08-07
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Publication No.: US11640833B2Publication Date: 2023-05-02
- Inventor: Shinji Eda
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JPJP2018-148923 20180807,JPJP2019-009901 20190124
- International Application: PCT/JP2019/031269 WO 20190807
- International Announcement: WO2020/032146 WO 20200213
- Main IPC: G11B5/735
- IPC: G11B5/735 ; G11B5/73
Abstract:
A disk-shaped substrate for a magnetic disk has a diameter D of 85 mm or more and a thickness T of 0.6 mm or less, and a material of the substrate has a Young's modulus E of 90 GPa or more.
Public/Granted literature
- US20210256999A1 SUBSTRATE FOR MAGNETIC DISK AND MAGNETIC DISK Public/Granted day:2021-08-19
Information query
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