Invention Grant
- Patent Title: Copper-alloy capping layers for metallization in touch-panel displays
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Application No.: US17838476Application Date: 2022-06-13
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Publication No.: US11640222B2Publication Date: 2023-05-02
- Inventor: Shuwei Sun , Francois-Charles Dary , Marc Abouaf , Patrick Hogan , Qi Zhang
- Applicant: Shuwei Sun , Francois-Charles Dary , Marc Abouaf , Patrick Hogan , Qi Zhang
- Applicant Address: US MA Framingham; US MA Newton; US MA Harvard; US MA Somerville; US MA Wellesley
- Assignee: Shuwei Sun,Francois-Charles Dary,Marc Abouaf,Patrick Hogan,Qi Zhang
- Current Assignee: Shuwei Sun,Francois-Charles Dary,Marc Abouaf,Patrick Hogan,Qi Zhang
- Current Assignee Address: US MA Framingham; US MA Newton; US MA Harvard; US MA Somerville; US MA Wellesley
- Agency: Morgan, Lewis & Bockius, LLP
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/041 ; H01B1/02 ; B81C1/00 ; C22F1/04 ; C22F1/00 ; C22F1/08 ; C22F1/14 ; C21D1/00 ; C21D9/00 ; H01L27/12 ; H01L29/49 ; H01L29/66 ; H01L29/786 ; H01L23/532 ; C23C30/00 ; C23C28/00 ; C23C28/02 ; B32B15/04 ; B32B17/06 ; B32B15/01 ; B32B15/20 ; B32B15/02 ; B32B15/18 ; C03C17/40 ; C03C17/36
Abstract:
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
Public/Granted literature
- US20220308705A1 COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS Public/Granted day:2022-09-29
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