Invention Grant
- Patent Title: Optical phased array chip using MEMS switch and manufacturing method thereof
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Application No.: US17576212Application Date: 2022-01-14
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Publication No.: US11640030B2Publication Date: 2023-05-02
- Inventor: Hyo-Hoon Park , Jong-Bum You , Dong-Eun Yoo , Ju-Beom Lee , In Ki Kim , Tae Joon Seok , Geumbong Kang , Hyeonho Yoon , Nam-Hyun Kwon
- Applicant: Korea Advanced Institute of Science and Technology , Gwangju Institute of Science and Technology
- Applicant Address: KR Daejeon; KR Gwangju
- Assignee: Korea Advanced Institute of Science and Technology,Gwangju Institute of Science and Technology
- Current Assignee: Korea Advanced Institute of Science and Technology,Gwangju Institute of Science and Technology
- Current Assignee Address: KR Daejeon; KR Gwangju
- Agency: Bums & Levinson, LLP
- Agent Joseph M. Maraia
- Priority: KR10-2021-0007201 20210119
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/136 ; B81B3/00

Abstract:
Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.
Public/Granted literature
- US20220229233A1 OPTICAL PHASED ARRAY CHIP USING MEMS SWITCH AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-07-21
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